通常，显微机械加工的部件和电子电路是分开制造的，然后在同一封装块内用线将它们连在一起。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
通常，显微机械加工的部件和电子电路是分开制造的，然后在同一封装块内用线将它们连在一起。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
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