我们公司是一家专门设计、生产集成电路和应用电子产品的公司。
Our company specializes in the design, production of integrated circuits and application of electronic products.
这些工艺的标准性使得我们可以利用单独的硅制造厂生产集成电路。
The standard nature of these processes permits us to engage independent silicon foundries to fabricate our integrated circuits.
英特尔系统的这些组件，包括激光器，都是使用和量产计算机集成电路同样的硅晶刻方式生产。
The components of the Intel system, including the lasers, are made with the same silicon-sculpting methods used to construct computer chips in vast quantities.
主要生产销售变容二极管和集成电路ic。
The main production and sales varactor diode and integrated circuit IC.
但是就当工程师们找到如何制作集成电路并进行大规模生产时，硅因为更容易使用而取代了锗。
But as engineers worked out how to make integrated circuits and manufacture them on a large scale, germanium was set aside for silicon because it's easier to work with.
集成电路的故障诊断是集成电路设计与生产过程中的一个重要部分。
Faults diagnosis is an important part of the integrate circuit design and production.
在工业控制、检测及生产管理中，这是一种非常实用的实时时钟集成电路。
This is a very practical integrated circuit of the real-time clock in the industrial control, detection and management of production.
CMOS集成电容绝对压力传感器是基于集成电路主流工艺集成的新型传感器，克服了传统传感器的缺点并利于批量生产。
Integrated absolute capacitive pressure sensors, coping with disadvantages of traditional sensors and being applicable of batch-processing, are novel sensors based on CMOS IC Technology.
把座标旋转计算机用于集成电路生产中的自动键合上是首次。
It is the first time to use the coordinate rotation computer in the automatic wire bonder for the integrated circuit production.
美国芯源系统有限公司是世界生产模拟线性电源集成电路的领先制造商之一。
Is one of the leading manufacturers of analog power integrated circuits in the world.
大规模集成电路是现代信息技术的基础，它的设计和生产水平已成为一个国家科技水平和工业能力的集中体现。
Large scale integrated circuit is the foundation of modern information technique. The designing and manufacturing level of it embodies a country's national scientific level and industrial ability.
器件模型则是联系集成电路设计和生产的纽带。
Device model is the bridge which links the designing and manufacturing of integrated circuit together.
目前，刻蚀技术已经成为集成电路生产中的标准技术，干法刻蚀设备亦成为关键设备。
Now etching has be-come the standard technology, and etching equipment is the key equipment in IC production.
本发明涉及多层介电结构的生产并涉及包含这些结构的半导体设备和集成电路。
The invention relates to the production of multilayered dielectric structures and to semiconductor devices and integrated circuits comprising these structures.
光刻是大规模集成电路生产流程中十分关键的一环，而光刻中使用的掩模的质量对大规模集成电路的成品率有很大的影响。
In the manufacture process of integrated circuit (IC), lithography occupy a very important step, and the quality of photomask used in lithography affects the yield of LSI.
随着集成电路生产工艺的进展，互连线在集成电路设计中的影响越来越大。
With the development of IC process technology, the impact of interconnects on the design of IC's is becoming greater.
本实用新型可保护薄膜不受污染，提高半导体集成电路生产过程中的照相平版印刷质量。
The utility model can protect the film from pollution and increases the printing quality of photolithography during the production of semiconductor integrated circuits.
将MAXIM公司生产的充电专用集成电路MAX713与单片机相结合，设计快速充放电设备，是现今充放电系统设计的主流。
Combining the specialized IC- MAX713 produced by MAXIM with MCU, to design quick charge & discharge device is the main trend of designing charge & discharge system.
装箱问题是个在工业生产中经常碰到的问题，如集装箱的装载、板材的切割、集成电路的设计、报纸的排版等等。
Packing problem is faced in many industries, for example, the container loading, the sheet cutting, the design of VLSI and the newspaper editor.
并且目前各大公司生产的超大规模集成电路芯片基本全部具有边界扫描结构。
Grand scale IC chip that every important company produces at present is almost all having the boundary scan structure.
在集成电路和微波模块批量或规模生产中，无论就性能还是就成本而言，封装技术都是值得重视的关键技术。
The selection of package subtrate is also introduced, For mass production of integrated circuits and microwave modules. packaging is very critical in terms of either perform…
该公司承诺生产制造具有最高标准的品质，可靠性和服务的集成电路。
The Company is committed to manufacturing integrated circuits with the highest standards of quality, reliability and service.
该试剂用于清除匀胶后残留于硅片边缘及背面的光刻胶，已经广泛应用于中、大规模集成电路及其它半导体器件的生产。
The chemical is widely used in the production of LSI, VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
通过使用集成电路生产技术，能够批量生产此专利成像系统，而且还能有效降低生产成本。
The disclosed imaging system can be manufactured on a large scale by using integrated circuit manufacturing techniques, reducing the manufacturing cost significantly.
最后综合以上分析，主要从生产要素开放度、内外部动力机制建设等方面提出了提升我国集成电路设计产业竞争力的具体对策。
At last, it integrates the above study and points out the countermeasures to rise the competitiveness of our IC design industry from the open of producing factors, drive mechanism and so on.
该肖特基二极管及其制造方法能够满足金属氧化物半导体工艺的需求，并适用于亚微米集成电路的集成生产。
The Schottky diode and the method of making same same can meet the requirements of metal-oxide-semiconductor process and be suitable for integrated production of sub-micro IC also.
公司专业生产经营电容、电阻、二、三极管、集成电路等产品。
The company produces and manages products such as electric capacity, resistance, diode, triode, etc, professionally.
公司专业生产经营电容、电阻、二、三极管、集成电路等产品。
The company produces and manages products such as electric capacity, resistance, diode, triode, etc, professionally.
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