采用苯甲酸铅做固化剂，通过对环氧树脂固化物的红外光谱及DSC曲线分析，认为苯甲酸铅是一种催化型固化剂。
Using lead benzoxy as curing agent, cured epoxy resin was analyzed by means of IR spectrum and DSC curves. Lead benzoxy was considered to be catalytic curing agent.
研究了阻燃环氧树脂固化物样品规格、质量、组成、性质及环境对其氧指数测定结果的影响，对测定结果的判据进行了有益的改进。
This paper was Concerned the influence of the regular, quality, composition, properties of the cured epoxy resin and test environment on the LOI determination, also reported a favourable im.
胺。常被用作环氧树脂固化剂的化合物。
结果表明，液体聚硫聚脲齐聚物的用量、齐聚物中聚脲含量对固化后的环氧树脂玻璃化温度、模量及形态有较大影响。
The results show that the level of polysulfide polyurea and the content of hard segment in polysulfide polyurea influence the morphology, T_g and modulus of cured epoxy resin.
以液体聚硫聚脲齐聚物来增韧环氧-聚酰胺体系，用DMTA和SEM研究了固化后环氧树脂的形态结构、相分离程度和增韧效果。
The measurement of DMTA and SEM was used to study the morphology and structure of the cured epoxy, identifying the degree of phase segregation and the effect of toughening in the cured epoxy.
研究了油酸和三乙烯四胺的生成物油酰多胺对环氧树脂和甲基四氢苯酐固化物性能的影响。
The influence of oleoyl polyamine prepared by oleic acid and triethylene-tetramine on the properties of cured product of epoxy resin and methyhetrahydrophthalic anhydride(MTHPA)was studied.
本文研究了固化剂和预聚物用量对环氧树脂性能的影响。
The effect of the amounts of curing agent and prepolymer on the properties of cured epoxy resins were investigated.
常被用作环氧树脂固化剂的化合物。
以环氧树脂为基体，间苯二胺和氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
体系中水泥水化的主要产物为C - S -H凝胶和水化铝酸钙，而且水化产物多为凝胶体和微细晶体，环氧树脂固化后，有机物呈网络胶状体。
The main hydration products in the system are C-S-H gel and micro-crystal hydrated calcium aluminate. When epoxy resin is solidified, the organism is network.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
综述了有机硅改性环氧树脂的主要方法及改性物固化机理、固化物性能研究进展。
This paper reviews research progress in method of epoxy resin modified hy organic silicon, as well as curing mechanics, the properties of crosslinked resin.
本论文研究的复合封装材料以双酚A型环氧树脂EP828／E51作为基体，以氧化铝作为填充材料，有望替代纯环氧固化物作为脉冲压电电源用新型封装材料。
The encapsulate composite for pulsed piezoelectric power supplier was investigated in this paper, in which a bisphenol A liquid epoxy EP828/E51 was resin matrix and aluminum oxide was filler.
本发明属固化剂技术领域，具体为一种新型环氧树脂组合物。
This invention is a neotype ethoxyline resin compounds, and it's belongs to curing agent technological field.
该组合物由环氧树脂化合物和固化抑制剂混合组成。
The compounding is made of ethoxyline resin chemicals and solidification inhibitor.
采用E-44环氧树脂与丙烯酸反应，用鎓盐作催化剂，制备了适于配制竹木基涂饰的紫外光固化的环氧丙烯酸酯预聚物，讨论了催化剂的种类对合成反应的影响。
The UV-curable acrylated epoxy prepolymer resin was prepared by reacting E-44 epoxy resin with acrylic acid in the presence of onium salt catalyst.
研究了丙烯酸对环氧树脂的改性，丙烯酸和环氧树脂反应，降低了固化物的交联密度。
The Toughening effect of Acrylic Acid on epoxy resin was investigated. The crosslink density in the cured resin would be decreased by the reaction of acrylic arid with resin.
一种双极板，由包含至少一种环氧树脂、石墨填充物以及作为环氧树脂固化剂的金属胺络合物的组合物制成。
The bipolar plate is made from a composition containing at least epoxy resin, graphite filler and a metal amine complex compound taken as an epoxy resin curing agent.
一种双极板，由包含至少一种环氧树脂、石墨填充物以及作为环氧树脂固化剂的金属胺络合物的组合物制成。
The bipolar plate is made from a composition containing at least epoxy resin, graphite filler and a metal amine complex compound taken as an epoxy resin curing agent.
应用推荐