本研究以计算流体力学的方法，对电子构装产品的明日之星- - -球栅阵列封装方式，来进行详细的热传分析。
In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array package that is popular in modern electronic industry.
从理论计算和实验研究等方面对国内外多孔建筑材料的传热、传湿及热湿耦合传递研究方面的进展进行了综合分析。
Reviews the theoretical and experimental research home and abroad on the heat transfer, mass transfer and coupled heat and mass transfer in porous building materials.
从理论计算和实验研究等方面对国内外多孔建筑材料的传热、传湿及热湿耦合传递研究方面的进展进行了综合分析。
Reviews the theoretical and experimental research home and abroad on the heat transfer, mass transfer and coupled heat and mass transfer in porous building materials.
应用推荐