激光捕获显微切割术(LCM)是近年来发展起来的一种新技术。
Laser capture microdissection(LCM) is a novel technique developed in recent years.
刃口可通过扭转、切割、磨削、机械加工、激光显微机 械加工或喷钢砂处理形成。
The cutting edges may be formed by torsioning, cutting, grinding, machining, laser micromachining, or grit blasting.
刃口可通过扭转、切割、磨削、机械加工、激光显微机 械加工或喷钢砂处理形成。
The cutting edges may be formed by torsioning, cutting, grinding, machining, laser micromachining, or grit blasting.
应用推荐