板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计，声音微图像己经成为检测这些封装的非常重要的一部分。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
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