这些纳米天线由蚀刻硅晶片制作而成，用到了制作微处理器所需的高端技术，塑料片可以塑型，能适合示汽车和任何便携式电子产品的外壳。
The stamps themselves are made by etching silicon wafers using the technique that makes microprocessors, and the sheets can be shaped to coat anything from cars to portable electronic devices.
目前LED同硅晶片的制作设备类似，都是通过在蓝宝石衬底片上沉淀氮化镓层实现。
At present these LEDs are made in machines similar to those used to make silicon chips, by depositing layers of gallium nitride on sapphire-based wafers.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
本发明揭示一种用于制作从晶片的背侧检测光的成像器的结构及方法。
A structure and method for fabricating imagers that detect light from the backside of the wafer.
准确的修边量控制技术使得用我们的修边晶片所制作的晶体电性能一致性非常好。
The unique beveling knowhow contributes us with very good consistency at the electronic characteristics of crystal.
准确的修边量控制技术使得用我们的修边晶片所制作的晶体电性能一致性非常好。
The unique beveling knowhow contributes us with very good consistency at the electronic characteristics of crystal.
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