采用化学腐蚀法，通过控制有机酸腐蚀后焊料烘干的氧分压和温度控制焊料表面氧化层厚度。
Chemical removal approach is utilized and the oxide thickness is controlled by controlling the oxygen pressure and temperature during solder drying after organic acid removal.
采用化学腐蚀法，通过控制有机酸腐蚀后焊料烘干的氧分压和温度控制焊料表面氧化层厚度。
Chemical removal approach is utilized and the oxide thickness is controlled by controlling the oxygen pressure and temperature during solder drying after organic acid removal.
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