熔融性比较差的镀膜材料在蒸发过程中以直接气化为主，挖坑效应比较明显。
Materials without good melting property will not be melted and digging effect will exhibit evidently when electronic beam irradiating on it.
熔融性比较差的镀膜材料在蒸发过程中以直接气化为主，挖坑效应比较明显。
Materials without good melting property will not be melted and digging effect will exhibit evidently when electronic beam irradiating on it.
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