以透明玻璃或石英当做永久性基板之发光二极体。
Light emitting diode with a permanent substrate of transparent glass or quartz and the method...
可挠性基板中的金属作为阻隔层而使氧及蒸汽渗透到OLED减至最小。
The metal in the flexible baseboard as obstruct layer makes oxygen and vapor impregnate the OLED to minimum.
本发明提供氧化锡层的电阻小且氧化锡层的近红外光的吸收量少的太阳能电池用透明导电性基板。
A transparent conductive substrate for solar cell that is low in the resistance of tin oxide layer, being less in the amount of near-infrared ray absorbed by the tin oxide layer.
本发明的课题在于提供一种耐折性、蚀刻特性、与抗蚀剂的粘合性优异、没有表面缺陷的两层挠性基板。
The invention provides a two-layer flexible substrate which is free from surface defects, while being excellent in flexural strength, etching characteristics and adhesion to a resist.
因此，本发明的软性基板10是既具有良好的柔软性、耐冲击性及气体屏障性，又具有良好的耐热性的基板。
Such a flexible substrate (10) is excellent not only in flexibility, impact resistance and gas barrier properties, but also in heat resistance.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
本发明提供一种线式头及图像形成装置。本发明提供一种能够对在透光性基板的表面上形成有多个透镜的透镜阵列提高脱模性的技术。
The invention provides a line head and an image forming apparatus, a technology of improving release property for lens array with a plurality of lens on a surface of a transmissive substrate.
彩色钢板是以镀锌为基板又用硅酮作为表面，经两涂两烘加工而成，耐久性也较好。
Galvanized substrate and silicone surface is used and after twice painting and twice baking its durability becomes well.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
食糖消费量增加，因此可能是由于在基板的可用性和降低柠檬酸的增加可能是由于不良的传热传质和贫氧的可用性。
Increased sugar consumption may therefore be due to increase in substrate availability and reduced citric acid may be due to poor heat and mass transfer and poor oxygen availability.
因此，基板上存在的铜部分和通过电镀形成的铜沉积物之间的连接的可靠性是显著的。
Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.
因此，可以提高显示器基板的检查可靠性。
Therefore, it can increase the checking reliability of the display cardinal plate.
良好的耐热性、平整性和更高级的厚度控制是浩荣公司基板的最大特色。
Good heat resistance, flatness and better thickness control is the most significant feature of HaoRong's substrates.
该焊接对象通过该焊块与该基板进行电性连接。
The welding object is electrically connected with the substrate through the welding blocks.
所述影像感测器与所述基板电性连接，且收容在所述镜头模组内。
The image sensor is electrically connected with the substrate, and is accommodated in the lens module.
模型包括离子连续性方程、动量方程和泊松方程，特别是提出了可以自洽地决定绝缘基板表面电势、表面电荷密度和鞘层厚度关系的等效电路方程。
The equivalent circuit model gives the instantaneous relationship between the sheath thickness and the surface potential at an insulating substrate placed on the pulse-biased electrode.
以及多个第二凸块，配置在所述第二芯片与所述对接基板之间，使所述第二芯片透过所述第二凸块与所述对接基板电性连接。
The second bumps are disposed between the second chip and the joint substrate so that the second chip can be connected with the joint substrate electrically.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
第一焊线电性连接第一芯片与中继线路基板之间。
The first bonding wire is electrically connected between the first chip and the relay circuit base board.
第二焊线电性连接于中继线路基板与承载器之间。
The second bonding wire is electrically connected between the relay circuit base board and the loader.
样品：对于木材上漆，与染色颜色及光洁度要求，提交关于木基板实际样品代表性的样品。
B. samples: For each type of wood finish, with stain color and gloss required. Submit samples on representative samples of actual wood substrates.
竞争性抑制竞争性抑制剂与底物竞争酶的活性部位，降低酶的约束力基板的可能性，并观察到的反应速度放缓。
Competitive INHIBITION Competitive inhibitors compete with substrate for an enzyme's active site, lowering the enzyme's likelihood of binding substrate and slowing the observed reaction velocity.
该组合物能够改进构成喷墨记录头的基板和油墨流动通路形成元件之间的粘合性。
The composition improves adhesion between a substrate and an ink flow path forming member which constitute the ink-jet recording head.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
由此，得到一种层间连接部被压缩且具有高连接可靠性的多层印刷线路基板。
Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
本发明涉及一种满足结构紧凑、便利、适应性强等各种要求的对基板作业系统。
The present invention relates to a working system for a substrate that fulfils various kinds of requirements, such as compactness, excellent convenience, and flexibility.
铝基板（TCB），具有优异的高导热性。可靠性和耐热性。
Thermal Conductive Board (TCB), or Insulated Metal Substrate (IMS), provides the advantages of high thermal conductivity, reliability and thermal resistance.
计算中同时考虑了基板作用引起的双轴对称性。
In addition, the symmetry of the biaxiality induced by the surface action is considered in this simulation.
一种微接触元件及其制造方法，其步骤包含有：在一表面不具导电 性的基板上成形一导电薄膜；
The method includes steps: forming a conductive film on a surface of not electroconductive base plate;
一种微接触元件及其制造方法，其步骤包含有：在一表面不具导电 性的基板上成形一导电薄膜；
The method includes steps: forming a conductive film on a surface of not electroconductive base plate;
应用推荐