• 无线传感器节点作为微型器件电源能量有限,故节点能耗直接影响着节点的寿命

    Wireless sensor node as a micro-device, has limited power supply energy. So the energy consumption of the node has a direct impact on the lifetime of the node.

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  • 介绍具有更高加工分辨率直接成形复杂微型器件的一次曝光型微立体光刻成形装置

    An once exposition micro stereo-lithography prototyping device with higher machining resolution and can be used for directly prototyping 3d complex microstructure is introduced in this paper.

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  • 生物芯片微小面积上,利用微加工技术结合有关的化学合成技术制造而成具有一定分子生物学检验功能的微型器件

    Biochip is in the small area, using of micro-processing technology, combined with the chemical synthesis technology to create micro-devices, which have the function of molecular biology test.

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  • 现代微处理器需要十亿美元的被称为fab工厂表面蚀刻出使其得以运作微型电子器件

    A modern microprocessor requires a billion-dollar plant called a fab to etch onto its surface the tiny electronic components that make it run.

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  • 这项进展可能会引发出新电子器件比如显示三维(3d)图象手机微型电视

    The advance could lead to a new generation of electronic devices, such as cell phones or miniature televisions that display three-dimensional (3d) images.

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  • 茨、他们同事肖恩·道格拉斯(Shawn Douglas)这个方法建造微型组件原则上这些组件组装复杂功能器件

    Dietz, Shih and their colleague Shawn Douglas used this method to build tiny components that could, in principle, be assembled into more complex functional devices.

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  • 他们使用自己从零开始制造的光电子器件微型天线控制电路块LED无线芯片集成隐形眼镜中。

    They integrated miniature antennas, control circuits, an LED and radio chips into the lens using optoelectronic components they built from scratch.

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  • 自动装配系统实现微型功能器件接口器件与微流控芯片装配关键设备

    Automatic microassembly system is the key equipment to realize the assembly of miniature function device and interface device.

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  • 微型功能器件以及接口器件芯片上的应用加快微流控芯片实现产业化商品化进程

    Miniature function device and interface device are applied to microfluidic chip, which has accelerated the industrialization and commercialization process of microfluidic chip.

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  • 微型功能器件以及对外接口器件芯片上的应用加快了微流控芯片实现产业化商品化进程

    Miniature function device and interface device are applied to microfluidic chip, which has accelerated the process that the microfluidic chip realizes industrialization and commercializes.

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  • 作为新型热电器件微型热电器件发电制冷传感器等领域获得重要应用

    As a new type device, the micro thermoelectric devices have been used as cooler, generator and sensor.

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  • 介绍一种微型输液硬件设计思想电路原理电路中的一些关键器件作了介绍

    Discusses the hardware designing idea on a Miniature Infusion Pump and introduces circuit principle and main devices.

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  • 通道中的冷凝热管微型燃料电池器件有着广泛应用。

    Condensation in microchannels has been widely used in a variety of advanced micro thermal devices, such as micro heat pipe and micro fuel cell.

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  • 介绍了近年美国德国中国等在微型温差器件制造材料研究方面的相关研究成果

    The recent development and related results about the micro thermoelectric devices in American, Germany, and China were introduced .

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  • 设计微型压力传感器阵列有效满足边界层分离检测要求进一步拓展了MEMS器件工程应用范围

    This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary - layer separation point, and expand engineering applied scope of MEMS devices.

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  • 典型机电一体化部件电力电子器件装置、可程序控制器模糊控制器、微型电机传感器专用集成电路伺服机构等

    Typical electromechanical integration yuan, components are: power electronic devices and devices, programmable logic controller, fuzzy controller, micro-motors, sensors, ASIC, servo institutions.

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  • 光学微型波器一种新型器件,主要用于热释电红外敏感器

    The optical microchopper is a new type device for pyroelectric infrared image sensor.

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  • 器件市场需求急剧增加,微弯曲成形微型产品制造中起着至关重要作用

    With the rapid increase of market demand for micro parts, micro bending formation plays an important role in the fabrication of micro products.

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  • 研究旨在提高微型空间推进器微型气体涡轮机等微器件性能

    This research is aimed at improving the performance of micro-space propulsions and micro-gas turbine generators.

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  • 针对具体应用环境,微型传感器电子器件的长期自供提供了思路。

    According to practical applications, the micro-sensors and the electronic devices can be powered forever by energy harvesting.

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  • 微机电系统(MEMS)技术凭借精密集成加工特点,具有微型成本可靠性可大批量生产等优势,接触器件领域大有可为

    MEMS , owning the advantages of ultra fine integrate process , miniaturization, low cost, high reliability and batch manufacturing, pose very promising future in the micro electric contact device.

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  • 摩尔解释道,摩尔定律主要推动因素包括芯片规模生产设计改进器件永无止境微型

    Moore's Law is driven, as Moore explained, largely by economies of scale in producing chips, improvements in design, and the relentless miniaturization of component parts.

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  • 近年来,基于压电薄膜技术微机械加工技术的微型压电器件受到了人们的日益关注

    In recent years, much attention has been paid to novel miniature piezoelectric devices which based on piezoelectric thin film technology and MEMS technology.

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  • 传统同位素电池能量转换结构采用单层阵列形式,造成电池输出功率较小不能满足微型传感需求

    Traditional Radioisotope micro Battery (RMB) with direct conversion device of single layer array does not meet the requirements of micro sensor devices for its lower output power.

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  • 介绍新型微型电容式指纹传感FPC 1010功能特点使用方法,并给出个指纹采集识别应用实例

    This article starts to introduce the functional characteristics and usage of one new capacitive fingerprint sensing device FPC1010. Then, it offers an applying example of fingerprint identification.

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  • 表面等离子波导实现全光回路基础设计制作应用对于集成光学器件走向微型化和高密度化具有重要的意义。

    The SPWs are the foundation to achieve the optical circuit. The design, facture and application have great significance for integrated optical components to miniaturization and highly density.

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  • 半导体工业制造结构尺寸小于70纳米器件能力允许器件持续微型

    The ability to fabricate structures with dimension less than 70nm allow the continuation of miniaturization of devices in the semiconductor industry.

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  • 微型光栅结构薄膜由于残余应力存在引起器件光学机械性能方面发生显著变化。

    Effects of residual stresses on the optical and mechanical performances of MEMS-based microgratings were investigated using finite element simulation method.

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  • 近年来,电子设备不断趋向小型化微型化,对电子器件提出高效能、小型化、集成化要求

    In recent years, there is a trend that electronic equipments constantly becoming smaller, which requires electronic components with high-performance, miniaturization, and integration.

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  • 近年来,电子设备不断趋向小型化微型化,对电子器件提出高效能、小型化、集成化要求

    In recent years, there is a trend that electronic equipments constantly becoming smaller, which requires electronic components with high-performance, miniaturization, and integration.

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