简要论述了电子工业中接插件硬金镀层的耐磨机理，获得硬金镀层的镀液，节金代金以及镀金层的质量检测等问题。
The present paper deals with the bath for hard gold plating, the quantity controll and the wear mechanism of coatings as well.
简要论述了电子工业中接插件硬金镀层的耐磨机理，获得硬金镀层的镀液，节金代金以及镀金层的质量检测等问题。
The present paper deals with the bath for hard gold plating, the quantity controll and the wear mechanism of coatings as well.
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