然后基于实验研究,并结合三维全波电磁仿真软件在频域和时域对通孔结构性能进行分析。
And then, based on experiments and combined with three-dimensional full-wave electromagnetic simulation software, the frequency domain and time domain performance of the through-hole via is analyzed.
然后基于实验研究,并结合三维全波电磁仿真软件在频域和时域对通孔结构性能进行分析。
And then, based on experiments and combined with three-dimensional full-wave electromagnetic simulation software, the frequency domain and time domain performance of the through-hole via is analyzed.
应用推荐