对多芯片组件的布线方法提出了一种新的方法。
This paper presented a new method for multi chip module routing.
多芯片组件（MCM）是实现电子系统小型化的重要手段之一。
MCM is an important method of miniaturizing electronic systems.
分别采用三种不同的技术对多芯片组件互连延迟进行建模，并给出了相应的解。
Interconnection delay in MCM 's is modeled by using three different techniques, and the associated formulas are also derived.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
多芯片组件是实现电子装备小型化、轻量化、高性能、低成本专用集成电路不可缺少的关键技术。
MCM is the necessary technique to realize the equipment smaller, lighter, more excellent performance and lower cost.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules (MCMs).
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。
Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
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