结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
在健合工艺中，基板和健合温度主要影响到热应力的大小。
In the bonding process, the substrate and the temperature mainly effect the thermal stress.
光学遮罩层是包括一第二族-第六族半导体化 合物及一陶瓷材料，光学遮罩层是设置于第一基板之上；
The optical shade layer, which is composed of a second generation-sixth generation semiconductor compound and a ceramic material, is positioned on the first basal plate;
光学遮罩层是包括一第二族-第六族半导体化 合物及一陶瓷材料，光学遮罩层是设置于第一基板之上；
The optical shade layer, which is composed of a second generation-sixth generation semiconductor compound and a ceramic material, is positioned on the first basal plate;
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