BAE系统公司已在Nashua微电子工厂生产复合半导体mmics和设备超过20年，主要用于该公司的电子战、通信、雷达和武器系统。
BAE systems has produced compound semiconductor MMICs and devices in its Nashua facility for more than 20 years for use in the company's electronic warfare, communications, radar, and weapon systems.
韩国半导体巨头在星期三启用了一套用于航空产品线的研发设备，预示其向大量生产太阳能电池迈出了战略性的一步。
The Korean semiconductor giant opened on Wednesday a research and development facility for a pilot production line, signifying an aggressive move towards mass production of solar cells.
我们生产和销售半导体设备，如标准整流器，快速整流器和超高速整流器，肖特基二极管，稳压二极管，TVS二极体和高压二极管。
We produce and sell Semiconductor Devices like Standard Rectifiers, fast Rectifiers and Ultrafast Rectifiers, Schottky Diodes, Zener Diodes, TVS Diodes and HV Diodes.
日本东光株式会社创立于1955年，是一家综合性电子设备制造商，专业生产线圈相关产品及电子陶瓷和半导体产品。
TOKO, found in 1955, is a comprehensive electronic device manufacturer that provides coil-related products, as well as electro-ceramic and semiconductor products.
目前快速响应市场和降低成本成为半导体企业重点强调的目标，这就需要较短的生产周期和最大限度地使用最少的设备。
Recently on time to market and low cost are the strong emphasises in the semiconductor industry, which require short cycle time and high utilization of a minimum number of tools.
本发明涉及多层介电结构的生产并涉及包含这些结构的半导体设备和集成电路。
The invention relates to the production of multilayered dielectric structures and to semiconductor devices and integrated circuits comprising these structures.
本实用新型涉及一种半导体器件生产的专用设备。
The utility model relates to a photochemical vapour deposition equipment which is the special equipment produced by a semiconductor device.
今天，它是全世界半导体、太阳能板和平板显示器制造设备的最大生产商。
Today, it is the world's biggest supplier of the equipment used to make semiconductors, solar panels and flat-panel displays.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
主要介绍了半导体晶圆rca清洗工艺以及半导体晶圆自动清洗设备在生产中的结构设计和应用情况。
This article introduces the clean process of RCA for silicon wafer, and the design and apply in the manufacture of this kind of silicon wafer auto clean equipment.
将重调度策略划分为半导体生产线、设备组和设备重调度层次，利用仿真评价确定优化的重调度策略，并获得样本数据。
The rescheduling strategies are divided into line layer, machine group layer and machine layer. The samples for FNN are setup by simulation evaluation.
将重调度策略划分为半导体生产线、设备组和设备重调度层次，利用仿真评价确定优化的重调度策略，并获得样本数据。
The rescheduling strategies are divided into line layer, machine group layer and machine layer. The samples for FNN are setup by simulation evaluation.
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