给出了基于该模型的超导陀螺转子偏移测试方案及其各参数间的关系。
Both the measurement scheme of the SCG rotor drift based on the model and its parameter relationship are presented.
若开关、互连电缆和测试夹具没有合适的屏蔽，所产生的杂散信号（偏移）将威胁到被测信号。
Without proper shielding of the switches, interconnecting cables, and test fixturing, spurious signals (offsets) may be generated that will compromise the signal being measured.
该方法不仅能够同时诊断元件的硬故障和参数偏移故障，而且能够同时运用于直流测试和交流测试。
The presented approach can not only diagnose both catastrophic faults and parametric faults, but also can be applied for both DC test and ac test.
本论文通过实验验证了光纤光栅技术在测试岩层变形时的可行性，波长的偏移可以反映模拟岩层的变形规律。
The feasibility of testing rock deformation by the optical fiber grating technology is verified in this paper. The drift can reflect the deformation.
结果采用不同质控菌株对同一抗生素药敏纸片进行测试，有助于了解、分析和确认测量值偏移原因。
Results It is of help of using different quality control strains with the same antimicrobial disk susceptibility test in unraveling, analyzing and identifying the deviations of the results.
采用激光二维扫描技术，实现了列车动态横向振动偏移量的测试，易于实施，数据准确，对制定合理的站台界限提供参考数据。
The planar laser scanning technique described in this paper realizes the measurement of train dynamic transversal vibrations offset easily and exactly.
介绍了光纤接续中由横向偏移带来的、轴向偏移造成的、纵向偏移产生的以及被接光纤具有不同的参数时所造成的附加衰减产生的机理及其测试方法。
The paper introduces excess loss based on lateral offset, axial offset, longitudinal offset, and different parameter value within a fiber splice, then, discusses the measurement method of excess loss.
通过光纤光栅波长偏移与温度和固化时间之间的关系测试，得到了树脂固化过程中残余应变的变化历程，成功实现了RTM工艺树脂固化过程中残余应变的在线监测。
The real time monitoring for residual strain induced by resin cure during the RTM process was realized by measuring the relationship among wave deflection, temperature and curing time.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
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