研究低温共烧压电陶瓷组分以及组分，结构及性能之联系。
Study the relationships between compositions, structures and properties of low temperature co-firing piezoelectric ceramics.
该螺旋体脉冲发生器包括两个低温共烧陶瓷部件共同制成的部分。
The spiral pulse generator comprises two parts which are manufactured jointly as an LTCC component.
还介绍了低温共烧陶瓷基板以及向微波频率扩展的前景与相应的工艺要求。
Compared with conventional microwave network, the LTCC substrate and its future expanding to microwave and corresponding technical requirements are also introduced in the paper.
指出了不同硼硅酸盐玻璃材料的优缺点和在低温共烧陶瓷技术中的适用范围。
The merits and defeds of different borosilicate glasses, its application field in LTCC technology were indicated.
本文提出一种新型的基于低温共烧陶瓷技术(LTCC)的螺旋电感带通滤波器。
A novel spiral inductor resonator bandpass filter based on LTCC is proposed in this paper.
LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。
Realization and progression of LTCC depends on two key joints of flow casting and low temperature co-fired ceramic in great degree.
LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。
Realization and progression of LTCC depends on two key joints of flow casting and low temperature co - fired ceramic in great degree.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
新开发的低损耗、低介电常数的低温共烧陶瓷(LTCC)材料最适合做微波mcm的基板材料。
The newly developed low loss, low dielectric constant and low temperature co fired ceramics (LTCC) materials are the best substrate for microwave MCM technology.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
多层陶瓷微波滤波器是一种基于低温陶瓷共烧技术的新型滤波器，具有小型化、轻便化和高频化特点，在通信、汽车、数字化家电等产品中已得到广泛应用。
Small size, low weigh and high working frequency are the characteristics of multilayer ceramic microwave filter, and it is now being employed in communication and electric products application.
多层陶瓷微波滤波器是一种基于低温陶瓷共烧技术的新型滤波器，具有小型化、轻便化和高频化特点，在通信、汽车、数字化家电等产品中已得到广泛应用。
Small size, low weigh and high working frequency are the characteristics of multilayer ceramic microwave filter, and it is now being employed in communication and electric products application.
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