采用二维电感模型，计算了带接地导体的有耗互连线的频变阻抗。
Two-dimensional inductance model is applied to calculate the frequency-dependent impedance of lossy interconnect lines with ground conductor.
在大量仿真数据以及当前集成电路设计工艺的基础上，提出了一种简单互连线负载的有效电容计算模型。
A simple and efficient model was presented for computing the effective capacitance of interconnect load based on simulation and integrated circuit process.
针对高损耗衬底，基于复镜像理论，结合部分元等效电路法，建立了一种新的片上互连线物理模型。
A new physical model for on-chip interconnect on high lossy substrate is proposed based on complex image theory and PEEC.
本文提出了大规模集成电路中互连线的特征模型。
The characteristic model of interconnects in VLSI is proposed.
提出一种基于工艺随机扰动的非均匀rlc互连线串扰分析方法；同时建立了互连线随机扰动模型。
A new method was proposed for the analysis of crosstalk of non-uniform RLC interconnects with stochastic process variations, and a stochastic perturbation model was proposed.
对有钝化层与无钝化层的铝互连线的热应力进行了数值模拟，并建立起互连线的二维有限元模型。
Two-dimensional finite element modeling was used to simulate the thermal stress in unpassivated and passivated aluminum thin film interconnects.
研究了多层金属互连网络的热学模型，详细计算了不同的介质材料、金属线间距、金属层间距和电流密度对多层金属互连线温度分布的影响。
Different dielectric material, metal wire separation, metal level separation and current density for impact of multilevel metal interconnects are calculated in detail.
研究了多层金属互连网络的热学模型，详细计算了不同的介质材料、金属线间距、金属层间距和电流密度对多层金属互连线温度分布的影响。
Different dielectric material, metal wire separation, metal level separation and current density for impact of multilevel metal interconnects are calculated in detail.
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