然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。

Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.

youdao

然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。

Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.

youdao