• 介绍电化学机械抛光原理工具特点

    The principle, tools and characteristics of the electrochemical-mechanical polishing were introduced.

    dict.cnki.net

  • 金刚石机械抛光化学抛光工艺机理进行了深入研究

    And the techniques and the mechanism of the EDM polishing, mechanical polishing, and oxidative-chemical polishing of diamond film were investigated.

    dict.cnki.net

  • 集成电路发展0.25微米工艺之后唯一可以实现全局平坦化的化学机械抛光CMP成为IC制程关键工艺之一。

    Since the technology node of IC developed to 0.25micron, as unique global planarization technology, chemical-mechanical polishing (CMP) has been the IC key process technology.

    dict.cnki.net

  • 用于甚大规模集成电路(ULSI制造关键平坦化工艺———化学机械抛光CMP技术进行了讨论

    The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.

    www.dictall.com

  • 循环过滤用来去除胶体化学机械抛光CMP)磨料中尺寸过大微粒

    Single stage re-circulation filtrations were performed to remove oversized particles from colloidal silica based Chemical-Mechanical Polishing(CMP)slurry.

    dict.cnki.net

  • 实验表明,脉冲电化学机械抛光一种有效镜面加工方法

    The experiments of polishing show that it is an effective mirror processes.

    dict.cnki.net

  • 抛光修整化学机械抛光重要过程之一。

    Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.

    danci.911cha.com

  • 化学-机械抛光CMP-平整抛光工艺采用化学移除机械抛光种方式。此工艺前道工艺使用

    Chemical-Mechanical Polish (CMP) - A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.

    www.tech-domain.com

  • 化学机械抛光一种复杂多相工艺

    Polishing pad is a key component of CMP system.

    danci.911cha.org

  • 目前化学机械抛光技术CMP被认为是能够实现晶圆表面局部平坦全局平坦最佳方法

    At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.

    dict.cnki.net

  • 抛光表面特性能可大大改变抛光流动情况,从而影响化学机械抛光抛光性能

    Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process, wherein the pad surface will alter the flow features considerably.

    www.dictall.com

  • 机械抛光借助于高速旋转抹有抛光抛光提高金属制件表面光亮度机械加工过程

    Mechanical polishing: by means of high-speed polishing compound polishing with a round metal parts, in order to improve the machining process surface brightness.

    www.hfsdm.cn

  • 化学机械抛光技术是迄今几乎唯一的全局平面化技术

    At present, chemical-mechanical polishing (CMP) has become a widely accepted global planarization technology.

    dict.cnki.net

  • 探讨机械抛光化学抛光和光抛光不同表面处理方法电极特性影响

    The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.

    www.xjishu.com

  • 形状金属机械抛光每块大小顾客的要求

    Specification: Metal ingot, mechanically polished, the detailed specification can be customized in size according to your request.

    www.dictall.com

  • X射线衍射测定金刚石残余应力研究机械抛光残余应力影响

    The residual stresses of the diamond film were measured by X-ray method, and the effect of the polishing condition on the stresses was investigated experimentally.

    dict.cnki.net

  • 化学机械抛光CMP半导体工业获得广泛赞同控制形貌起伏硅片表面当作首选方法

    Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.

    dict.cnki.net

  • 本文研究机械抛光化学抛光还原处理轴承表面测定影响

    In this paper mechanical polishing; Chemical polishing and hydrogen reduction methods used im cleaning bearing steel surface for oxygen determination have been studied.

    dict.cnki.net

  • 补偿化学机械抛光载具作为进行创新研发案例阐述方法流程步骤

    With compensation-oriented chemical mechanical polishing (CMP) as the carrier, the study elucidates the procedures of this method for the innovative research and development case.

    140.118.33.11

  • 一种化学机械抛光包含A苯乙烯聚合物B二烯聚合物构成的非水溶性基质

    A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (A) a styrene polymer and (B) a diene polymer.

    www.1168818.cn

  • 化学-机械抛光CMP-平整抛光晶圆片工艺采用化学移除机械抛光两种方式。此工艺在前道工艺使用。

    Chemical-Mechanical Polish (CMP) - A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing.

    www.2ic.cn

  • 介绍了半导体工业蓬勃发展的化学机械抛光(CMP)技术

    The Chemical mechanical polishing technique in the field of semiconductor industry was introduced.

    dict.cnki.net

  • 发明公开了一种化学机械抛光含有溶胶二氧化硅速率表面活性剂

    The invention discloses chemi-mechanical polishing liquid, which comprises a sol type silicon dioxide, a velocity accelerating auxiliary agent, a surfactant and water.

    ip.com

  • 发明提供用于抛光基板化学机械抛光组合物

    The invention provides a chemical-mechanical polishing composition for polishing a substrate.

    ip.com

  • 化学机械抛光CMP获得平滑无损伤铌酸锂基片有效加工方式

    Chemical mechanical polishing(CMP)is an efficient ultra-precise machining method to obtain ultra-smooth LiNbO3 wafer.

    www.dictall.com

  • 化学机械抛光粗糙表面微尺度流动抛光

    Chemical mechanical polishing Rough surface Microscale flow Polishing slurry;

    www.jiaoyu58.com

  • 化学机械抛光粗糙表面微尺度流动抛光

    Chemical mechanical polishing Rough surface Microscale flow Polishing slurry;

    www.jiaoyu58.com

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