通过研究，选择一种或两种无铅锡膏。
您不需要为更换无铅锡膏而更改钢板设计。
You should not have to change your stencil design to accommodate the change to lead-free.
无铅锡线是一种环保型，稳定性很好的产品。
Lead-free solder wire is one kind of environmental-friendly product with good stability.
无铅锡条是一种环保型，稳定性很好的产品。
Lead-free solder bar is one kind of environmental-friendly product with good stability.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The most obvious is the necessity for increased reflow temperature.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
So study lead-free solder paste in the electronic application package is important.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
实验表明，无铅锡膏在钢网上的流动性很差，导致沉积面积，体积和高度的最大值和最小值的波动变化十分明显；
Experimental results show that lead-free solder paste in the poor mobility of steel line, resulting in deposition area, volume and height of the maximum and minimum fluctuation is obvious;
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
本公司生产的有铅锡线已采用符合无铅要求的松香。
Rosin meeting the lead-free requirements is used for the lead-containing solder wires manufactured by our company.
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
涂锡铜带是由纯度达99.99%的TUI无氧铜材制成，产品表面光滑、平整，色泽均匀。在铜线表面涂敷了锡和铅以及其他化合物。
PV Ribbon, TUI oxygen-free copper belt high purity 99.99%, smooth, brilliant, cleaning, plated by dipping with tin and lead with different chemicals compositions.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
批发采购电镀助剂-供应666无铅无镍光亮厚白铜锡（电镀助剂）批发…
The lead-free nickel free white and bright nickel substitute plating process…bright nickel substitute tin salt 30g 666 lead-free nickel free white and …
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
所有的引脚均镀以100%雾锡，封装内无铅存在。
All leads are coated with 100% matte tin, and there is no lead inside the package.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
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