系统中的所有数据库访问都通过DAO进行以实现封装。
All database access in the system is made through a DAO to achieve encapsulation.
LED系统的生产厂商须采用先进的LED封装方法以保障LED色彩的一致性。
Manufacturer of LED systems shall utilize an advanced production LED binning process to maintain color consistency.
最后，以快速成型系统为例，描述了制造网格资源的描述、封装、发布和调用过程。
At the end, we take the rapid prototype system as example to explain the description, encapsulation, publication and invocation of MG-Resource.
服务层包含了所有分布式子系统的服务抽象和封装，以服务的方式供应用层使用。
The service layer contains all of the service abstraction of the distributed subsystems for application layer.
最终将封装好的协议以api接口的形式供s P客户端接入短消息系统。
The sealed protocol is provided for the SP client in the form of API interface.
最后，以光子网格中服务封装和资源调度实现为例，分别基于OGSA和AO - OGSA构建仿真模块，并根据软件系统性能指标对仿真结果进行了对比分析。
Therefore, it reduced the coupling between modules. Finally, taking the service packaging and resource scheduling in the optical grid as an example, the simulation modules based on OGSA and a...
因此，近年来，以陶瓷材料COB设计整合多晶封装与系统线路亦逐渐受到各封装与系统厂商的重视。
Thus, in recent years, ceramic polycrystalline COB packaging design and system integration are gradually from all packaging lines and system vendors attention.
因此，近年来，以陶瓷材料COB设计整合多晶封装与系统线路亦逐渐受到各封装与系统厂商的重视。
Thus, in recent years, ceramic polycrystalline COB packaging design and system integration are gradually from all packaging lines and system vendors attention.
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